Article List :  2008/10/11 : 3 posted

V48B24C250A - DC-DC Converter Module

Vicor Corp 2008/10/11 10:56

DESCRIPTION
This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.

Features
*DC input range: 36 - 75V
*Input surge withstand: 100V for 100ms
*DC output: 24V
*Programmable output: 10 to 110%
*Regulation: ±0.2%
*Efficiency: 88.5%
*Maximum operating temperature: 100°C at full load
*Power density: 100W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture

V24A15C250A, V48A15C250A, V300A15C250A, V375A15C250A, V24B15C250A, V48B15C250A, V300B15C250A, V375B15C250A, V24C15C250A, V48C15C250A, V300C15C250A, V375C15C250A, V24A15T250A, V48A15T250A, V300A15T250A, V375A15T250A, V24B15T250A, V48B15T250A, V300B15T250A, V375B15T250A, V24C15T250A, V48C15T250A, V300C15T250A, V375C15T250A, V24A15H250A, V48A15H250A, V300A15H250A, V375A15H250A, V24B15H250A, V48B15H250A, V300B15H250A, V375B15H250A, V24C15H250A, V48C15H250A, V300C15H250A, V375C15H250A, V24A15M250A, V48A15M250A, V300A15M250A, V375A15M250A, V24B15M250A, V48B15M250A, V300B15M250A, V375B15M250A, V24C15M250A, V48C15M250A, V300C15M250A, V375C15M250A
 

V48B24C250A - DC-DC Converter Module

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TK112XXCM - VOLTAGE REGULATOR WITH ON/OFF SWITCH

Toko Inc 2008/10/11 10:47

DESCRIPTION
The TK112xxC is a low dropout linear regulator with a builtin electronic switch. The internal switch can be controlled by TTL or CMOS logic levels. The device is in the “on” state when the control pin is pulled to a logic high level. An external capacitor can be connected to the noise bypass pin to lower the output noise level to 30 μVrms.
An internal PNP pass transistor is used to achieve a low dropout voltage of 170 mV (typ.) at 200 mA load current. The TK112xxC has a very low quiescent current of 65 μA at no load and 1.8 mA with a 100 mA load.The internal thermal shut down circuitry limits the junction temperature to150 °C.
The load current is internally monitored and the device will shut down in the presence of a short circuit or overcurrent condition at the output.
The TK112xxCM circuit features very high stability in both DC and AC. An output capacitor of 0.1 F provides stable operation for VOUT is higher or equal to 2.5 V. Any type of capacitor can be
used; however, the larger this capacitor is, the better the overall characteristics are. The ripple rejection ratio is 84 dB at 400 Hz, and 80 dB at 1 kHz.
The TK112xxC is available in the SOT23L-6 surface mount package.

FEATURES
*High Precision Voltage at ± 1.5% or ± 50 mV
*Active High On/Off Control
*Very Low Dropout Voltage: (Vdrop = 105 mV at 100 mA)
*Very Good Stability: CL = 0.1uF is Stable for any Type Capacitor with Vout higher or equal to 1.8 V (Iout > 0.5 mA)
*Excellent Ripple Rejection Ratio (80 dB @ 1 kHz)
*Very Low Quiescent Current (Iq = 65 uA at Iout = 0 mA)
*Peak Output Current is 480 mA
*SOT23L-6 Surface Mount Package
*Very Low Noise
*Built-in Reverse Bias Protection
*Internal Thermal Shutdown
*Short Circuit Protection

APPLICATIONS
*Battery Powered Systems
*Cellular Telephones
*Pagers
*Personal Communications Equipment
*Portable Instrumentation
*Portable Consumer Equipment
*Radio Control Systems
*Toys
*Low Voltage Systems

TK11215C, TK11216C, TK11217C, TK11218C, TK11219C, TK11220C, TK11221C, TK11222C, TK11223C, TK11224C, TK11225C, TK11226C, TK11227C, TK11228C, TK11229C,TK11230C, K11231C, TK11232C, TK11233C, TK11234C, TK11235C, TK11236C, TK11237C, TK11238C, TK11239C, TK11240C ,TK11241C,TK11242C, TK11243C, TK11244C, TK11245C, TK11246C, TK11247C, TK11248C, TK11249C, TK11250C  

TK112XXCM - VOLTAGE REGULATOR WITH ON/OFF SWITCH

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OMAP-L137 - Low-Power Applications Processor

Texas Instruments 2008/10/11 10:34

Description
The OMAP-L137 is a Low-power applications processor based on an ARM926EJ-S™ and a C674x™ DSP core. It provides significantly lower power than other members of the  MS320C6000™ platform of DSPs.
The OMAP-L137 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture of the OMAP-L137 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and
processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.
The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory
Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.
The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 also has a 1024KB ROM. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.
The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; two inter-integrated circuit (I2C) Bus interfaces; 3 multichannel audio serial port (McASP) with 16/12/4 serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with RTS and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can
be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals; and 2 external memory interfaces: an synchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration.
The HPI, I2C, SPI, USB1.1 and USB2.0 ports allow the OMAP-L137 to easily control peripheral devices and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The OMAP-L137 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

Features
*Applications
- Industrial Control
- USB, Networking
- High-Speed Encoding
- Professional Audio
*Software Support
– TI DSP/BIOS™
– Chip Support Library and DSP Library
*Dual Core SoC
– 300-MHz ARM926EJ-S™ RISC MPU
– 300-MHz C674x™ VLIW DSP
*ARM926EJ-S Core
– 32-Bit and 16-Bit (Thumb®) Instructions
– DSP Instruction Extensions
– Single Cycle MAC
– ARM® Jazelle® Technology
– EmbeddedICE-RT™ for Real-Time Debug
*ARM9 Memory Architecture
*C674x Instruction Set Features
– Superset of the C67x+™ and C64x+™ ISAs
– 2400/1800 C674x MIPS/MFLOPS
– Byte-Addressable (8-/16-/32-/64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
- Normalization, Saturation, Bit-Counting
- Compact 16-Bit Instructions
*C674x Two Level Cache Memory Architecture
– 32K-Byte L1P Program RAM/Cache
– 32K-Byte L1D Data RAM/Cache
– 256K-Byte L2 Unified Mapped RAM/Cache
– Flexible RAM/Cache Partition (L1 and L2)
– 1024K-Byte L2 ROM
*Enhanced Direct-Memory-Access Controller 3 (EDMA3):
– 2 Transfer Controllers
– 32 Independent DMA Channels
– 8 Quick DMA Channels
– Programmable Transfer Burst Size
*TMS320C674x™ Floating Point VLIW DSP Core
– LSouapdp-oSrttore Architecture With Non-Aligned
– 64 General-Purpose Registers (32 Bit)
– Six ALU (32-/40-Bit) Functional Units
– Two Multiply Functional Units
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Hardware Support for Modulo Loop Operation
– Protected Mode Operation
– Exceptions Support for Error Detection and Program Redirecrion
*128K-Byte RAM Shared Memory
*Two External Memory Interfaces:
– EMIFA
– EMIFB
*Three Configurable 16550 type UART Modules:
– UART0 With Modem Control Signals
– 16-byte FIFO
– 16x or 13x Oversampling Option
*LCD Controller
*Two Serial Peripheral Interfaces (SPI) Each With One Chip-Select
*Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
*Two Master/Slave Inter-Integrated Circuit (I2C Bus™)
*USB 1.1 OHCI (Host) With Integrated PHY (USB1)
*USB 2.0 OTG Port With Integrated PHY (USB0)
– USB 2.0 High-/Full-Speed Client
– USB 2.0 High-/Full-/Low-Speed Host
– End Point 0 (Control)
– End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
*Three Multichannel Audio Serial Ports:
– Transmit/Receive Clocks up to 50 MHz
– Six Clock Zones and 28 Serial Data Pins
- Supports TDM, I2S, and Similar Formats
- DIT-Capavle (McASP2)
- FIFO buffers for Transmit and Receive
*10/100 Mb/s Ethernet MAC (EMAC):
– IEEE 802.3 Compliant (3.3-V I/O Only)
– RMII Media Independent Interface
– Management Data I/O (MDIO) Module
*One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus For High Bandwidth
*Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
*One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
*One 64-Bit General-Purpose Timer (Watch Dog)
*Three Enhanced Pulse Width Modulators (eHRPWM):
– Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
– 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
– Dead-Band Generation
– PWM Chopping by High-Frequency Carrier
– Trip Zone Input
*Three 32-Bit Enhanced Capture Modules (eCAP):
- Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator(APWM)outputs
- Single Shot Capture of up to Four Event Time-Stamps
*Two 32-Bit Enhanced Quadrature Encoder Pulse Modules (eQEP)
*256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
*Commercial or Extended Temperature

OMAPL137ZKB3, XOMAPL137ZKB3  

OMAP-L137 - Low-Power Applications Processor

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