DESCRIPTION
In Microsemi's Powermite® surface mount package, these zener diodes provide power-handling capabilities (3.0 WATTS) found in larger packages.
In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink.
Its innovative design makes this device ideal for use with automatic insertion equipment.

FEATURES
* Surface Mount Packaging
* Integral Heat Sink Locking Tabs
* Compatible with automatic insertion equipment
* Full metallic bottom eliminates flux entrapment
* Zener voltage 3.3 to 200 Volts
* Low reverse leakage
* Tight tolerance available
* ESD Rating of >16kV per human body model
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