This DC-DC converter module uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary and secondary windings, resulting in low in-toout parasitic capacitance and noise.
High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.

*DC input range: 36 - 75V
*Input surge withstand: 100V for 100ms
*DC output: 24V
*Programmable output: 10 to 110%
*Regulation: ±0.2%
*Efficiency: 88.5%
*Maximum operating temperature: 100°C at full load
*Power density: 100W/cubic inch
*Height above board: 0.43 in. (10,9 mm)
*Parallelable, with N+M fault tolerance
*Low noise ZCS/ZVS architecture

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