Article List :  Diode : 42 posted

XBS013S15 - Schottky Barrier Diode, 100mA, 30V Type

Torex 2008/09/22 09:46

FEATURES
*Forward Voltage : VF=0.71V (TYP.)
*Forward Current : IF(AV)=100mA
*Repetitive Peak Reverse Voltage : VRM=30V

APPLICATIONS
*Low Current Rectification

 

XBS013S15 - Schottky Barrier Diode, 100mA, 30V Type

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HPND-4005 - Beam Lead PIN Diode

Agilent Technologies 2008/09/10 10:41

DESCRIPTION
The HPND-4005 planar beam lead PIN diode is constructed to offer exceptional lead strength while achieving excellent electrical performance at high frequencies.
High beam strength offers users superior assembly yield, while extremely low capacitance allows high isolation to be realized.
Nitride passivation and polyimide coating provide reliable device protection.

FEATURES
*High Breakdown Voltage 120 V Typical
*Low Capacitance 0.017 pF Typical
*Low Resistance 4.7 W Typical
*Rugged Construction 4 Grams Minimum Lead Pull
*Nitride Passivated

APPLICATIONS
The HPND-4005 beam lead PIN diode is designed for use in stripline or microstrip circuits.
Applications include switching, attenuating, phase shifting, limiting, and modulating at microwave frequencies. The extremely low capacitance of the HPND-4005 makes it ideal for
circuits requiring high isolation in a series diode configuration.  

HPND-4005 - Beam Lead PIN Diode

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TAG Beam, Diode


MP03XXX360 - Dual Thyristor, Thyristor/Diode Module

Dynex 2008/07/30 09:14

FEATURES
* Dual Device Module
* Electrically Isolated Package
* Pressure Contact Construction
* International Standard Footprint
* Alumina (Non Toxic) Isolation Medium

APPLICATIONS
* Motor Control
* Controlled Rectifier Bridges
* Heater Control
* AC Phase Control

MP03HBT360-12
MP03HBN360-12
MP03HBP360-12
 

MP03XXX360 - Dual Thyristor, Thyristor/Diode Module

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1PMT5913B - 3.0 WATT Zener Diodes

Microsemi 2008/07/22 10:41

DESCRIPTION
In Microsemi's Powermite® surface mount package, these zener diodes provide power-handling capabilities (3.0 WATTS) found in larger packages.
In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink.
Its innovative design makes this device ideal for use with automatic insertion equipment.

FEATURES
* Surface Mount Packaging
* Integral Heat Sink Locking Tabs
* Compatible with automatic insertion equipment
* Full metallic bottom eliminates flux entrapment
* Zener voltage 3.3 to 200 Volts
* Low reverse leakage
* Tight tolerance available
* ESD Rating of >16kV per human body model  

1PMT5913B - 3.0 WATT Zener Diodes

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TAG Diode, Zener


CDBU0230R - SMD Schottky Barrier Diode

Comchip Technology 2008/07/15 09:06

Features
* Low forward Voltage
* Designed for mounting on small surface.
* Extremely thin/leadless package.
* Majority carrier conduction.

Mechanical data
* Case: SOD-523F (1608) Standard package , molded plastic.
* Terminals: Gold plated, solderable per MIL-STD-750, method 2026.
* Polarity: Indicated by cathode band.
* Mounting position: Any.
* Weight: 0.003 gram (approximately).  

CDBU0230R - SMD Schottky Barrier Diode

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